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FPC/PCB Hot Bar Soldering Machine Soldering Machine with Pulse Heat
| MOQ: | 1 Set |
| Price: | USD 2000-9999 |
| Standard Packaging: | plywooden case |
| Delivery Period: | 3 days after receive the payment |
| Payment Method: | T/T L/C D/P Western Union |
| Supply Capacity: | 300 sets/ month |
pcb board soldering machine
,pcb soldering machine
FPC/PCB Hot Bar Soldering Machine/Welding Machine with Pulse Heat
Specifications:
FPC Soldering Machine CWPC-1A
1. Accurate Tin press,not drag.
2. Accurate heat.
3. Fine-pitch position.
4. Digital program pressure control.
Features:
FPC to PCB Board Pulse-Heated Soldering Machine/Welding Machine
1.Extremely short cycle time with rotary table design. Product loading and
unloading can be done during the heat sealing process.
2.High quality heat seal application up to 0.25mm pitch.
3.Pneumatic bonding head provide up to 3,900N force.
4.Digital programmable pressure control with LCD display.
5.Closed loop PID temperature control with visible LED display.
6.Bonding cycle is triggered by a real time pressure sensor.
7.Floating Thermode ensure consistent pressure and heat transfer along
the flexfoil to LCD and/or PCB.
8.Precision product fixtures (2X), easy exchange, provided with micrometer
alignment and vacuum to fix components.
9.Optional CCD alignment module with frame, camera, lens, monitor and
illumination for fine pitch application.
10.Full microprocessor logic control.
Parameters:
Model: CWHP-1A
Size: 500mm X 750mm X 910mm
Work Air Pressure: 0.5-0.7MPA
Working Area: 110mm X 150mm
Temperature setup: 0-400℃
Tolerance of Temp: +2℃
Time of pressing: 0-99s
Tolerance of Pressing: 0.05MPA
Description:
Hot bar soldering is extremely effective in bonding components and parts
that are dissimilar and difficult to unite. Several examples are listed above,
but there are many other soldering situations that call hot bar reflow soldering
system. This technology, also known as pulse bonding, differs from traditional
soldering since the reflow process uses thermode technology, which is based
on rapid reflow by pulse heating. This procedure allows materials with low
temperature resistance to be soldered at high lead-free temperatures without
damage to the flex. It selectively solders parts by heating them to a temperature
that's high enough to cause their adhesive or solder to melt and then re-solidify
to form a permanent bond.
Company info:
Our best service:
1. Engineer overseas tranning for customers.
2. Promise day technical support services.
3. Limit the handling of complaints, half an hour back to customers.
4. Reliable machine maker,we get Experts--15,each one got over six
years experience,equipment quality will be satisfying.
Our Clients:
CE Approval
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Always wanted:
If you have any Machine Tool Documentation, Description, Catalog or Pricelists of any age I would be interested to hear from you.
Website:http://www.pcb-depanelizer.com
