MOQ: | 1 Set |
Price: | USD 2000-9999 |
Standard Packaging: | plywooden case |
Delivery Period: | 3 work days |
Payment Method: | T/T L/C D/P Western Union |
Supply Capacity: | 800 sets per year |
PCB thickness | 0.1-2.0mm |
PCB material | FPC/FR4 |
Data input formats | Gerber, X-Gerber, DXF |
Cooling | Water |
Weight | 1500kgs |
Name | UV Laser PCB Separator |
PCB depaneling (singulation) laser machines have become increasingly popular as boards become smaller, thinner, and more complex. Traditional mechanical methods like routing and die cutting create mechanical stress that can damage delicate circuits, especially in flexible PCBs. Our UV laser solution provides a precise, non-contact depaneling method that eliminates these risks while maintaining high throughput.
Laser class | 1 |
Max. working area (X x Y x Z) | 300 mm x 300 mm x 11 mm |
Max. recognition area (X x Y) | 300 mm x 300 mm |
Max. material size (X x Y) | 350 mm x 350 mm |
Data input formats | Gerber, X-Gerber, DXF, HPGL |
Positioning accuracy | ± 25 μm (1 Mil) |
Diameter of focused laser beam | 20 μm (0.8 Mil) |
Laser wavelength | 355 nm |
System dimensions (W x H x D) | 1000mm*940mm*1520 mm |
Weight | ~ 450 kg (990 lbs) |
Power supply | 230 VAC, 50-60 Hz, 3 kVA |
Cooling | Air-cooled (internal water-air cooling) |
Ambient temperature | 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm |
Humidity | < 60 % (non-condensing) |
Required accessories | Exhaust unit |