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355nm Laser Depaneling Machine Customized With 460x460mm Working Area
| MOQ: | 1 Set |
| Price: | USD 2000-9999 |
| Standard Packaging: | plywooden case |
| Delivery Period: | 3 work days |
| Payment Method: | T/T L/C D/P Western Union |
| Supply Capacity: | 800 sets per year |
Detail Information
Place of Origin
China
Brand Name
ChuangWei
Certification
CE Certification
Model Number
CWVC-5L
Power(W):
10/15/18W
Working Area:
460*460mm(standard)
Shipping:
FOB / EXW/DHL
Dimension:
Customized
Laser Brand:
Optowave
Name:
Laser Cutter
Highlight:
355nm Laser Depaneling Machine
,355nm pcb depaneling cutter
,Customized Laser Depaneling Machine
Product Description
Inline Laser PCB Depaneling Machine with 355nm Laser Wavelength
Product Specifications
| Attribute | Value |
|---|---|
| Power(W) | 10/15/18W |
| Working area | 460*460mm (standard) |
| Shipping | FOB / EXW/DHL |
| Dimension | Customized |
| Laser Brand | Optowave |
| Name | Laser Cutter |
PCB Depaneling Machine Laser Cutter with 355nm Laser Wavelength
Challenges of Traditional Depaneling Methods
- Damages and fractures to substrates and circuits due to mechanical stress
- Damages to PCB due to accumulated debris
- Constant need for new bits, custom dies, and blades
- Lack of versatility - each new application requires ordering of custom tools
- Not suitable for high precision, multi-dimensional or complicated cuts
- Ineffective for depaneling smaller boards
Lasers provide superior PCB depaneling/singulation with higher precision, lower stress on components, and increased throughput. Laser depaneling adapts to various applications through simple setting changes, eliminating tool maintenance, lead times for replacement parts, and substrate damage from mechanical torque.
Advantages of Laser PCB Depaneling/Singulation
- No mechanical stress on substrates or circuits
- Eliminates tooling costs and consumables
- Versatile operation with simple setting adjustments
- Fiducial recognition for precise, clean cuts
- Optical recognition prior to depaneling process
- Compatible with virtually any substrate (Rogers, FR4, ChemA, Teflon, ceramics, metals)
- Exceptional cut quality with tolerances under 50 microns
- No design limitations - cuts complex contours and multidimensional boards
Technical Specifications
| Laser | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Power | 10W/12W/15W/18W@30KHz |
| Positioning Precision | ±2μm |
| Repetition Precision | ±1μm |
| Effective Working Field | 400mmX300mm (Customizable) |
| Laser Scanning Speed | 2500mm/s (max) |
| Galvanometer Working Field | 40mmх40mm per process |
Laser Source
Why Choose Our Solution
- Global Technical Support: Engineers available for overseas machinery training and support
- Comprehensive Warranty: One year warranty for machines (excluding accessories) with free replacement parts
- Responsive Service: Prompt customer support and problem resolution
- Proven Expertise: 12 years experience in PCB separator machines with continuous R&D improvements
Certifications
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Dry Cabinet Production Process
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