Brief: Discover the Accurate Laser PCB Depaneling Machine with a remarkable positioning accuracy of 0.002mm. This advanced machine offers both inline and offline options, ensuring no mechanical stress on substrates, no tooling costs, and versatility for various applications. Perfect for cutting complex PCB boards with extraordinary precision.
Related Product Features:
Positioning accuracy of 0.002mm for ultra-precise cuts.
No mechanical stress on substrates or circuits, ensuring product integrity.
Versatile applications with easy settings changes for different substrates.
Fiducial recognition for precise and clean cuts every time.
Ability to depanel virtually any substrate including Rogers, FR4, and ceramics.
Extraordinary cut quality holding tolerances as small as <50 microns.
No design limitations, capable of cutting complex contours and multidimensional boards.
CE approved with robust frame construction and Japanese steel blades.
Faqs:
What is the positioning accuracy of the Laser PCB Depaneling Machine?
The machine boasts a positioning accuracy of 0.002mm, ensuring ultra-precise cuts for your PCB boards.
Can this machine handle different types of substrates?
Yes, it can depanel virtually any substrate including Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, and copper.
What are the advantages of using a laser for PCB depaneling?
Laser depaneling offers no mechanical stress on substrates, no tooling costs, versatility, fiducial recognition for precision, and the ability to cut complex designs with extraordinary quality.
Is technical support available for this machine?
Yes, engineers are available to provide overseas service, including machinery training and technical support.